Abatement technology just became a smaller issue.
Abatech manufactures the RPM-12 point of use scrubber for CVD/etch semiconductor, commercial and industrial applications, and the Silanator for silane treatment.
RPM-12 POU Scrubber | Silanator
RPM-12 POU Scrubber
Design
The RPM-12 is a co-current/counter-current wet scrubber.
- The rotary element replaces conventional "packing" used in other wet scrubbers.
- The rotary element creates high turbulence and intimate mixing between the scrubbing liquid and the exhaust gas.
- No solids accumulate inside the scrubber.
- No recirculation and no pH control are necessary.
- No pressure drop or rise at normal flows up to 10 cfm.
- Flexible framing options to accomodate space constraints.
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Efficiency
- Abatement Includes: NH3, HBr, HCl, HF, HNO3, TCS, DCS, metal halides, diatomic halogen gases, and silane (using the Silanator™).
- 99.9% efficiency at normal loads up to 10 cfm (280 lpm) verified by independent testing company.
- Applications include abatement of acids, ammonia, breathing, venting, or repack exhaust streams.
- Space efficiency: approximate 2-foot cube and 165 lbs. The RPM-12 will fit where conventional packed bed scrubbers will not. It is suitable for indoor (clean area) or outdoor installation.
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Safety, Reliability, and Maintenance
- The RPM-12 uses 0.5kW of power on a 120 VAC, 10 amp circuit.
- Reclaimed, or domestic feed water at 40 psig is sufficient to maintain 2.5 gpm for maximum efficiency.
- A vented gravity drain is required.
- An inert gas flow of 0-10 cfm is necessary for safe startup and shutdown.
- Most replacement parts are available from industrial supply sources.
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Silanator
The Silanator™ is a new, inexpensive, patented technology for silane destruction without burning. More importantly, the Silanator eliminates particulate formation.
- Successfully tested at a major Texas semiconductor facility.
- More accurately described as a flexible technology than a single piece of equipment.
- The Silanator™ can be configured and produced for your application because several geometries and flow rate capabilities are available.
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